半導体装置およびその製造方法

Semiconductor device and manufacture thereof

Abstract

(57)【要約】 【課題】 リード部のインダクタンスが低減された垂直 実装型の半導体装置、および量産的な製造方法の提供。 【解決手段】 一主面に電極が配設されている半導体チ ップ8と、前記電極に一端が電気的に接続し、他端が半 田バンプ10を成し半導体チップ8面に沿わせて一辺側に 導出され回路配線9と、前記半導体チップ8の少なくと も回路配線9が配設された面を封止する樹脂層11と、前 記半田バンプ10に電気的に接続して半導体チップ8端面 に突設されたボールバンプ12と、前記ボールバンプ12が 突設された半導体チップ8端面を絶縁被覆する絶縁体層 13とを有することを特徴とする半導体装置である。
PROBLEM TO BE SOLVED: To ensure high performance of a mounted circuit device easily by providing ball bumps projecting from the end face of a semiconductor chip while being connected electrically with solder bumps, and an insulator layer covering the end face of the semiconductor chip from which the ball bumps project thereby decreasing the inductance of a lead between mounting/ connection. SOLUTION: A circuit wiring 9 corresponding to each semiconductor chip is extended in a predetermined direction on the major surface of a semiconductor water 14 and a solder bump 10 is provided on a barrier layer 14a connected with the circuit wiring 9 in a region extending over a cut line thereof. The semiconductor wafer 14 provided with a resin layer 11 is then cut off along separation lines A, B and separated into semiconductor chips 8. The cutting face of the solder bump 10 is exposed, at least partially, to the cutting face of the solder bump 10 exposed to one cutting face and coated with an insulating resin 13. A solder ball is then arranged on each exposed cutting face of the solder bump 10 and bonded thereto by reflow thus projecting a ball bump 12.

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    JP-2014120612-AJune 30, 2014Toshiba Corp, 株式会社東芝Semiconductor device, and semiconductor module using the same